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Automated Welding for Wire Carrier Board Machine with Resistance Welding and No Tinning

Automated Welding concept for electronics wire carrier boards, combining payoff, cutting, stripping, tape bonding, component forming and resistance welding without tinning.

Automated Welding for Wire Carrier Board Machine with Resistance Welding and No Tinning cover image

Project Snapshot

Client Type
Electronics Component Manufacturer
Timeline
Project dated 2026-03-28
Deliverables
  • Overall machine and layout concept
  • Wire payoff, cutting, stripping and routing modules
  • Carrier-board magazine and tape-bonding process
  • Component cutting, forming and resistance-welding process

Background

Project scope

We designed an electronics component wire carrier board machine for a resistance-welding process that does not use tinning. The equipment concept combines wire payoff, wire cutting and stripping, carrier-board magazine feeding, tape bonding, component cutting/forming, welding and conveyor discharge into one line. That makes the scope an automated Welding application for wire feeding, cutting, stripping, carrier-board loading, taping, component forming and resistance welding.

The confirmed performance target is 1000 to 1200 pcs/h with 1 operator. The available project data does not include investment amount, labor-comparison data, ROI or payback period, so those figures are not claimed for this case.

Machine overview

Challenge

Replacing a tinning-dependent workflow

The product needs to be built through resistance welding without adding a tinning step. That makes component shape control, lead preparation, wire positioning and carrier-board transfer more important, because the welding process depends on consistent geometry and contact.

Managing wire length and carrier-board handling

The machine has to pull wire from a payoff rack, cut and strip the wire, combine it with carrier boards, bond with tape and feed the assembly into the welding section. The line also needs to support adjustable wire length from 110 to 1200 mm; when the wire length is above 1200 mm, the project layout notes that an auxiliary wire-tail arranging mechanism is required.

Approach

Machine layout

The layout includes a payoff rack, component welding machine, carrier-board machine, discharge conveyor, welding mechanism, cutting and forming mechanism, component magnetic box, tape unit, carrier-board loading magazine, wire inlet, wire arranging path, and wire cutting/stripping section.

Layout modules

ModuleConfirmed function
Payoff rackWire-roll supply, adjustable rack design
Carrier-board loading magazineStores and feeds carrier boards
Wire inlet and wire arranging pathGuides wire into the cutting and stripping section
Cutting and strippingCuts wire and strips insulation before board assembly
Tape unitBonds carrier board and wire
Component magnetic boxFeeds formed components
Cutting and forming mechanismCuts component leads and reshapes the part before welding
Welding mechanismResistance welding without tinning
Discharge conveyorReceives finished assemblies from the welding process

Process flow

The confirmed process route is:

  1. Wire is supplied from the payoff rack.
  2. The line cuts the wire.
  3. The line strips the wire.
  4. The carrier board is pushed out from the magazine.
  5. The carrier board and wire are bonded with tape.
  6. Components are loaded from the magnetic box.
  7. Component leads are cut and formed.
  8. The component and wire assembly is resistance welded.
  9. Finished assemblies discharge to the conveyor.

Process flow

Component forming change

The project requires a change to the component forming shape before welding. The modified target shape is intended to make the welding process simpler and more efficient. The visible dimensional callouts on the forming sketch include 12 +/- 0.5 mm, R0.65, R1.15, 14 mm, 15 mm, 17 +/- 0.5 mm and 4 mm.

Cutting and forming module

Carrier-board and wire handling

The payoff rack can be modified according to project requirements and is shown with capacity for 2 to 8 wire rolls. The carrier-board magazine is shown with storage for up to 50 carrier boards.

Board magazine

Reference dimensions and parameters

The dimension page provides layout reference values rather than a single complete envelope. The parameter table points back to the equipment outline drawing for layout reference size.

Dimension reference

ItemConfirmed specification
Machine height in main view1894 mm
Layout reference callouts2666 mm, 2050 mm, 758 mm, 1785 mm, 897.5 mm, 2359.5 mm and 2508.24 mm
Adjustable wire length110 to 1200 mm
Extra wire-tail handlingRequired when wire length exceeds 1200 mm
Payoff rack capacity2 to 8 wire rolls
Carrier-board magazine capacityUp to 50 carrier boards
Air supply0.5 to 0.7 MPa
Power supplyAC380V
Planned capacity1000 to 1200 pcs/h
Control systemHMI + PLC
Operator requirement1 operator

Outcome

Proposed operating result

The resulting line connects wire preparation, carrier-board transfer, tape bonding, component forming and resistance welding into a defined one-operator process. The no-tinning requirement is handled by controlling wire stripping, board alignment, component shape and welding contact instead of adding a separate tinning operation.

Process value

  The process value is integration: wire handling, board feeding, tape bonding, component forming, resistance welding and conveyor discharge are designed as one coordinated machine. Confirmed planning data supports a 1000 to 1200 pcs/h capacity range, AC380V power, 0.5 to 0.7 MPa air supply and HMI + PLC control. Commercial return figures are not included in the project data, so ROI is left unclaimed.
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