AOI and Lead Forming for Automatic Transistor Ferrite-Bead Insertion and Forming Cell

Project scope

We designed an automatic electronics component cell for transistor separation, ferrite-bead insertion, dispensing and tray loading. The machine is intended to replace a manual bead-insertion and dispensing flow with a controlled automated route that can feed transistor carriers, insert beads, dispense glue, inspect the result and unload finished carriers. That makes the scope an AOI and Lead Forming application for transistor ferrite-bead insertion, dispensing and tray loading.

The operating comparison in the project data shows one operator for the automatic machine and three operators for the manual bead-insertion and dispensing process. The listed carrier throughput is 90 pieces per hour for the automatic route and 100 to 120 pieces per hour for the manual route, with the note that output varies by the number of transistors on each carrier. We therefore treat this project primarily as a labor reduction, consistency and inspection-control case rather than claiming a higher raw hourly rate.

Multi-process integration

The machine has to coordinate carrier feeding, transistor transfer, bead feeding, bead insertion, glue dispensing, bead-position inspection, glue-presence inspection and final unloading. Each step depends on carrier positioning and stable transistor handling, so the layout needs more than a simple feeder-to-dispenser chain.

Inspection before release

The project includes CCD inspection for ferrite-bead placement and CCD inspection for glue presence. It also references an optional connected-axis flip check to identify missing glue caused by bead drop or displacement. That inspection requirement is central because a bead-insertion cell without verification can simply move defects downstream faster.

Process layout

We configured the full-machine process around A/B non-stop loading and unloading, carrier pushing, a waiting position, barcode collection, ferrite-bead bowl feeding, bead insertion, bead pressing, transistor guide-rail transfer, X-axis carrier motion, dispensing, CCD inspection and final carrier unloading.

Station	Confirmed function
A/B non-stop loading position	Keeps carrier feeding available without stopping the process
Carrier pusher	Push distance can be set
Barcode collection assembly	Captures carrier or product information before processing
Ferrite-bead vibration bowl	Feeds beads into the insertion station
Bead insertion module	Places ferrite beads onto the transistor carrier
Bead pressing module	Presses the bead into position
Dispensing module	Applies glue after bead insertion
CCD bead inspection	Checks ferrite-bead presence or placement
CCD glue inspection	Checks whether dispensing is present
A/B non-stop unloading position	Supports continuous carrier discharge, with settable unloading position

Bead insertion and sizing

The bead-feeding and insertion section uses a dedicated insertion mold. The reference dimension drawing lists a machine footprint of 1,460 mm by 710 mm and a height of 1,960 mm. We keep this as a planning value rather than a final installed size because the drawing is marked as a dimensional reference.

Proposed operating result

The proposed cell consolidates transistor carrier handling, bead insertion, dispensing, CCD inspection and tray loading into one automated machine. It reduces the operator requirement from three people in the manual reference process to one operator in the automated route, while adding barcode collection and inspection control.

Practical value

The data does not include investment amount or payback information, so we do not assign an ROI figure. The confirmed value is process control: A/B loading and unloading, adjustable push and unload positions, ferrite-bead insertion tooling, glue-presence detection and a defined inspection path before finished carriers leave the machine.