Automated Test System for Automated Assembly System for NTC Finishing Line with CCD Inspection and Auto Cleaning

Project scope

We designed an electronics sensor finishing line that covers NTC boarding, welding, automatic tinning, CCD inspection, automatic cleaning, encapsulation, shell insertion, resistance and hipot testing, and downstream manual finishing. That makes the scope an automated assembly system application for ntc finishing line with inspection and cleaning. That makes the scope an Automated Test System application for ntc finishing line with inspection and cleaning.

Process positioning

Compared with simpler NTC lines, this project adds explicit inspection and cleaning stations between the joining and encapsulation stages. The design is therefore focused on both throughput and tighter process control.

Mixed process stack

This line has to coordinate more distinct steps than the basic finishing-line projects: boarding, welding, tinning, CCD-based weld checking, automatic cleaning, encapsulation, shell insertion, resistance testing, hipot testing and later manual assembly tasks.

Compatibility and quality limits

We designed for compatibility with 24# and 26# twin wire and defined material and dimensional requirements such as cut length range, strip length tolerance, board dimensions and board loading quantity. The line also targets an overall defect rate below 0.5 percent.

Inspection after joining

The CCD section is used to detect weld-offset conditions after tinning and joining. That adds an inspection gate specifically intended to prevent poor alignment from flowing into encapsulation and later-stage operations.

Front-end configuration

We sized the boarding machine at about 2,000 pieces per hour and the welding and tinning sections at roughly 1,800 to 2,000 pieces per hour. It also gives detailed wire, strip and board parameter requirements for stable operation.

CCD and auto-cleaning sequence

After joining, the line inserts CCD inspection and an automatic cleaning machine. We treat this as a dedicated segment rather than a manual cleanup task, which helps standardize visual and solder-quality control before encapsulation.

Downstream finishing

The later process includes automatic encapsulation, shell insertion and dispensing, manual supplemental glue after bake, automatic resistance and hipot testing, and manual sleeve cutting, terminal insertion and plastic-seat work. The plan also quantifies board counts and capacity for a 20,000-piece daily target.

Key technical parameters

Area	Configuration	Planning value
Wire compatibility	Twin wire	24# to 26#
Wire length	Cutting and boarding section	50 to 1,200 mm
Strip length tolerance	Front-end stripping	+/- 0.5 mm
Board loading	Empty board and finished-board handling	60 to 80 empty boards, 25 to 30 finished boards
Boarding machine	Real operating efficiency	2,000 to 2,500 pcs/hour
Welding and tinning	Welding plus four-station tinning sequence	1,800 to 2,000 pcs/hour
CCD inspection	Dedicated inline weld-offset inspection	1,800 to 2,000 pcs/hour
Automatic cleaning	Dual-station cleaning machine	1,800 to 2,000 pcs/hour
Encapsulation	One encapsulation machine	6,000 to 7,000 pcs/hour
Resistance and hipot test	One automatic tester	3,000 to 4,000 pcs/hour

Equipment package

We added CCD inspection and automatic cleaning between joining and encapsulation, so the line can catch weld-offset issues before potting. The technical package also includes five turnover carts, 60 encapsulation frames, 150 potting fixtures, one potting machine and one resistance/hipot test machine. The original investment model estimates CNY 151,300 in tooling, CNY 1.95 million in equipment and CNY 2.1013 million total investment, with six online operators planned for the automated flow.

Proposed operating result

The resulting line concept is more quality-controlled than the simpler NTC flows because it adds inline inspection and cleaning before encapsulation. We position it as a complete finishing route rather than only a set of machines.

Capacity and control value

The design is configured around a 20,000-piece daily target and adds structured quality controls such as CCD offset inspection, explicit dimensional requirements and automated resistance and high-voltage verification. That combination improves process consistency without pretending every downstream handling step should be fully automated.